![]() ![]() There are various methods of baking – which method to use is dependent upon the nature of the part and the required timeline of the job. This ensures that when the parts are soldered there is almost zero moisture in the packages and the risk of part damage (or “popcorning”) is eliminated. ![]() MSL 6 parts can only be left out for 6 hours before baking is required.īaking integrated circuits allows the water to evaporate gradually and completely. These levels range from MSL 1 (which can be left in the open indefinitely and will not absorb any moisture) to MSL 6. The higher the Moisture Sensitivity Level, the more rapidly the part will absorb water. Moisture sensitivity of a particular integrated circuit is defined by its Moisture Sensitivity Level. The visible damage done to the part is called “popcorning.” The force of these bubbles (the force of the expanding water) deforms the part and often damages the internal components. The boiling causes bubbles to form inside of the plastic packaging. Due to the high temperature of the reflow process, the water absorbed by the part boils. ![]() The major concern with moisture sensitive parts is that the plastic packaging around the part will absorb water (typically from the air.) When it comes time to assemble a circuit board and the part undergoes reflow soldering, the moisture in the packaging can have very destructive effects. ![]()
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